Curing of epoxy resin Epidian® 6 containing reactive organosilicon filler - A differential scanning calorimetry study
Authors:
- Beata Mossety-Leszczak,
- Paulina Ostyńska,
- Michał Dutkiewicz,
- Hieronim Maciejewski,
- Henryk Galina
Abstract
The curing reaction of epoxy resin Epidian 6 with or without an addition of reactive filler, octakis-[(3-glycidoxypropyl)dimethylsiloxy]octasilsesquioxane (POSS-OG), was investigated using differential scanning calorimetry (DSC). The curing agent was 4,4′-diaminodiphenyl-methane (DDM). Based on the analysis of the thermograms recorded at different heating rates the kinetics of curing reactions in the examined systems was determined using the Model Free Kinetics method. The experimental results obtained by DSC isothermal analysis in the temperature range 60-160 °C, with temperature modulation TOPEM®, were used to construct TTT (time-temperature-transformation) diagram for epoxy resin Epidian 6 compositions with or without POSS-OG.
- Record ID
- UAMfdfcf2c4974b45bd965f70b0cb195ccf
- Author
- Journal series
- Polimery, ISSN 0032-2725
- Issue year
- 2013
- Vol
- 58
- Pages
- 212-218
- ASJC Classification
- ; ;
- DOI
- DOI:10.14314/polimery.2013.212 Opening in a new tab
- Language
- (en) English
- Score (nominal)
- 15
- Score source
- journalList
- Score
- Publication indicators
- = 2; = 3; : 2013 = 0.591; : 2013 (2 years) = 0.617 - 2013 (5 years) =0.574
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- Uniform Resource Identifier
- https://researchportal.amu.edu.pl/info/article/UAMfdfcf2c4974b45bd965f70b0cb195ccf/
- URN
urn:amu-prod:UAMfdfcf2c4974b45bd965f70b0cb195ccf
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or PerishOpening in a new tab system.